Abstract:
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Integrated circuits have kept their secrets for far too long. Mounted in ceramic carrier at best, or encapsulated in epoxy for worst, recovering a clean silicon die for study can present challenges of varying difficulties. This step is however instrumental in order to study the circuitry for reverse engineering or ROM decoding, and identify manufacturing process and security measures implemented at the silicon level. Establishing a large catalog of silicon die photos is also instrumental in identifying an unknown chip without markings or enigmatic embedded microprocessor architecture by comparison with a reference collection. Here is a glimpse from the workshop which aimed at exploring the various techniques that can be used to remove chip packaging, such as hot air, rosin/DMSO, nitric/sulphuric acid and fiber laser. Participants of the workshop were able to try their hand at using the hot air technique which provide excellent results with inexpensive tools and no chemical hazard.
#chipdecapping #silicon #hardwaresecurity #hardwear_io #hw_ioUSA2023
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