Get up cawksucka, it's a beautiful day

What's wrong with talking?

Actually it’s not that good. You’re just easily impressed.

@@swashington942 r/whoosh

@@keyboardwarrior2418 some people talk too much and no info.

Ikr

ITs Not a thumbnail but clickbait

it's not the incorrect example It's the X example edit: this is a bad joke, ignore this lmfao

that's not a mistake... that's called clickbait. "oh my god, a really good method i know of doesn't work? i have to check this out to see why the other methods are better!"

@@lintycarcass This

Gets to the point? It's a five minute video and the only bit that actually matters is the last 2 seconds.

@@kjdavis1 Well yes but ...... Okay you're right I just realized that I agree with you.

You really needed a guide for this? That says a lot about the size of your brain 😂

@@Mikael-jt1hk you lack self awareness if u think your statement in and of itself doesn't say a lot about your own intelligence. curb your ego; get off that high horse. nobody respects an insufferable dickhead that can't act their own age.

The funny thing is the video test optimal placement for a inferior product, if going that in depth might as well make a guide on applying liquid thermal paste, the actual top of line conductivity.

Try going into your history and searching thermal paste or pc builds more generally and then removing them.

+1 for this brah@@benjaminrogers8875

😂😂😂😂👍🏻👊💥💯

They may try toothpaste ads before giving up

Lmao

That is me ...i mean it i used the whole tube ....not the one from my cooler used that to but also a tube i hade laying around...i followed this video called the verge 2000$ gaming pc

Use it for everything at home. Even for cooking.

@@thewhiterabbit133 WeLl ThE pC WoRkS tHo

N O

No 5 min intro and annoying please subscribe!

who cares, people will keep saying a center pea size is better (and is not, even worse on ryzen).. and there are already videos like this one 10 years ago.

Agreed but everything depends on how much paste u apply.

Cassiopeia and yet you cared enough to waste your precious time to make a pointless comment.

Ill use spread

What about dot pattern

The four corners of die will have less coverage (fillet height) than the middle section of the die edge. @@ArunG273

​@@ArunG273I could imagine that it is prone to forming bubbles

I just installed my Ryzen 7 5800x using this method, after watching demos of ALL the methods. This one is the best.!

Most lógica is to use a spread card and cover whole thing in very thin layer. All those shapes are just going to expand and not cover the whole chip since it’s a square. If the cross doesn’t come out the ends then you know it didn’t reach the inside corners of the cross. I don’t know why people are so scared to cover the whole cpu, the paste isn’t conductive so any that comes out just wipe off of you want don’t even have to. Better to have whole squared covered than a shaped expanded that doesn’t make a square.

After delidding a CPU and seeing that most of what needed to be covered is to one side of the chip or the other, spreading is absolutely the smartest thing to do; if you're worried you spread it to thin, then apply more, as long as you're not using a conductive paste then it doesn't matter if it comes out the side like you said!

I usually do the 5 dot but aftef this im definitely going with the X

the X has found to be one of the quickest and most effective solutions around.

indeed brother

you need to have non conductive thermal paste tho just to make sure nothing will get destroyed

Sometime it doesn't tho, I rather just use the spread method for 100% coverage.

Lmao

Is that your dog in the thumbnail?

@@rknine7998 yessir

@@kejkej2065 fajny pies

@@benjapizarro981 limão 🍋🍋🍋

lmao

lmao

Oof

Stop😂😂

It's essentially good pc building practice.

Danke

@@tachumilk4142 nein

@@ekssdeexd2424 👀

@Erdem spread is the most effective

@Erdem easiest*

It spread perfectly into full square covered cpu

@@jasonlong9196 yea no shit

@@jasonlong9196 ur redundant, he og commenter but the time stamp already.

I? ? 7?740000ć0đ🇦🇨

@@jocke8219 ?

Thumbnail is kinda lame tho

@@lucasrosalino3035 appealing for the dumbest people = more views and alghorhitm shit. Welcome to modern days..

That clear glass thing he was using, he had to reapply the thermal paste anyways to mount the CPU cooler

The end result is that you get inaccurate results to satisfy the masses

It's not an effective method to show how paste spreads, when you screw down the block on your CPU socket it applies much more pressure than what you can do by hand like that, the paste also heats up with your cpu, which makes it spread further. The result here also show max Temps, which could've been a single second spike. I've applied with all methods, with sufficient paste, your cpu always gets covered completely.

The thermal paste spread also depends if you tighten the screws randomly or evenly in a criss cross method

@@TechReflex but he didn't meassure with the glass, so the results should be correct. And if you choose a good method, less paste should be sufficient. Worst would be bad method and to less or to much paste. So for people with no idea how much to take, it's even more helpfull. I did go with a cross most times, once i gave spreading a try.

I've seen a few people do it before but usually people just whine its either not comparable as you aren't as strong or "you could have used more paste on your single spot". Kinda missing the point.

@@TechReflex Wait he didn't actually measure the temps with the glass right. That was just for demonstration

Wait wat

Noo the verge method is totaly 100% work

why not spread as thin as possible and then do some cross on top with cross center getting more than outer parts?

@@alkaponas to much thermal paste will make it over heat as well.

@@alkaponas I made like that Spread as thin as possible and then center bit long dot And I get a good results

I'm not sure the pressure he's applying to that glass is the same pressure that gets applied when cranking down a heat sink. Using the single dot method seems to work pretty good when cranking a heat sink down because when I remove the heat sink it is applied all the way across the CPU every time.

it is what you will get when you think more about certain thing.

What’s that plastic thing he’s using

@@emma6648 it's just a simple piece of flat plastic to press down on the paste so it spreads out

its fucking terrible, it showed nothing, you do realise the second after that video cuts the temperatures quickly rise again, wya better to actually just apply a heatsing to it and let it run for 5-10 minutes with each method to get a true result

lmaoo

This is copy pasted from another video bro

😂😂😂😂😂

Thank you, haven't laughed like that in a while

Just buy freezer bro then

🙌🔥

Lyrical boxing !

Damn this is golden 💪🏿

This is good

Always been the best choice. Maximum spread and no chance of bubbles.

Lol

Piece of advice, overapply or spread it on the gpu die. Otherwise you risk very real damage to the gpu. With the cpu you have the ihs and either thermal paste under it or solder as a buffer before you risk damage.

cross can be replaced by 4 points only in cross (extreme points also meeting center together)

@@ArtisChronicles what is GPU die?

@@HassaanALal die is the top of the gpu chip where you would put the thermal compound, also cpu die same thing.

Daddy i find u every video stop spying on me >:(

Justin Y.5

@@driptoop3650 nigga tf

Stfu

@@driptoop3650 did u just call him.. Hol up

Test your might!!

Nice, with conductive paste you also have the fatality option

Freezer method.

*Fatality*

*FATALITY*

Well.. he stopped pushing just as the paste arrived at the borders. We don't have the luxury of seeing the paste when placing the cooler. This method can get really messy.

Tri poloski is the best :D

You want a smaller X In the middle. That would result in good coverage without the spillage.

@@FahdRiyami i did that, i got visually temp change, before lowest cpu temp was 42C and on load 81C (very cheap paste) after appling GD-900 lowest 31C on load 70C

It's not recommended. There are 2 potential issues with this, 1st you might introduce bubble in the thermal paste. 2nd, you might get a overflow and that could get the paste into somewhere it shouldnt

Einfach nur Müll immer das selbe.

Clickbait

@Frederick Röders yeah only for money people doing anything

Only stupid people would assume that as click bait, it was just some “art” he did while also using the emojis...nonetheless he a concise information during the video so you should be thankful

Not a chance. There is absolutly a correct way to use thermal paste.

​@@timcotton6503like what? As long as you dont put too little youre pretty much set

​@@timcotton6503according to this video there's many correct ways to apply it.

​@@timcotton6503explain

yeah, but seldom are

Not that simple, contact pressure matters too.

No, yuo need just a "thin layer" of the thermal paste

@@noway8233 Hence the contact pressure, which squeezes it to the point where parts of the metal of the heatsink are contacting parts of the metal of the heat spreader, with the paste only serving to fill in the gaps from the texture of the surfaces.

@@soundspark yeah, if both ihs and coldblade of a cooler would have perfect even surfface, you wouldnt need any thermal paste.

Perfect thread in a video that *seems* to be clear-cut, showing our eyes The Truth. We all thank you for your diligence.

Intel a bag of lying dicks Ryzen-

I always spread -Abraham Lincoln

That might be true for their shit stock cooler but for anything aftermarket, the mounting pressure is just so high that air cannot possibly be trapped with the paste.

Intel doesn't know what they are talking about. I use Elmer's glue and place my motherboard in the microwave for 5 minutes for maximum adhesion. I guarantee my pc has lower temps than anyone here, mainly because it doesn't turn on.

@@dronenoobFL LOL

Maybe he lives in aan Asian country. It's actually a cool temperature in summers. Normal Summer temps go as high as 45° in room. And that's the average.

30*C is 86* F Celsius to Fahrenheit

Yeah, south east asian is really hot ans humid, such a pain for computers 😂

The downside is that the information doesn't accurately represent results

While the method really doesn't matter if you have enough paste I'd still avoid using the single dot method myself, it's harder to judge how much paste to use and there is a risk of uneven spreading depending on evenness of the cooler's mounting pressure (however small this risk may be). I would personally go with the cross or spreading methods just for the peace of mind of knowing for sure there is full coverage, especially on a larger CPU package like that of ThreadRipper.

Basically just wait for the paste to settle after an hour

With a dot, it will spread as a circle, so to get to the edges, you will have some spilling from the sides...

@@arnauddebroissia8964 except that thermal paste expands with higher temps so after a week it would cover it completely

@@needforspeedgaming7148 so before you have to wait 1 week to get full performance? Naw man i'm good with my own method.

same result as spread

@@Chriscs7 but faster and easier

@@the_emmo *if you're not buying bulk paste that comes in a can, anyway

KP Delaney same. Low effort for high results

That's how a cpu cooler would apply pressure tho

@@pantwearer not really

@@pantwearer Your heatsink does not bent does it?

the testing is still pretty accurate tho since they must have tested it with a real cooler :)

@@toxx1220 real cooler is both flatter, more rigid and pressed against the cpu with higher and more even pressure. Point is, application method doesn't matter as long as **enough** thermal paste is applied.

Even with more paste, its still unlikely to reach the corners with one dot method.. without accidentally applying too much and going over the edges. Its clear the one dot method is the worst, but some people can't admit when they are wrong and continue using an interior method for years... Almost any other method is better that dot. It's just facts

@@jkjkjkkjkjk Whatever you may think ... in practice, when replacing thermal paste, I have never observed incomplete coverage of the package surface. I guess that also depends on the pressure the heat sink applies.

@@Andreas_Straub in every single test that I've seen like this one, it's the thin even spread over the whole cpu that has the best temperatures. The point of thermal paste is to fill the gap between the heatsink and the CPU, so any square millimeter left uncovered by thermal paste is going to result in increased temperature. Also, there's a video on youtube of someone take Arctic Silver 5 and placing in under the CPU pins and firing up the computer and it works just fine lol. More is more when it comes to thermal paste.

@@Andreas_Straub yes. When the cpu is pressed against its heat sink there is enough pressure to make many methods work. It's very hard to mess up thermal paste. More problems come with the mount and heat sink then the paste itself. Had a GPU core getting hot just a few weeks after doing paste and thermal pads. (This 3060 came brand new with terrible thermal pads.). Anyway, with heat expansion and contraction, what initially gave a wonderful 54C at full load became 73 and then it'd throttle back about 35% of what it's capability was. I opened it up to investigate. Thermal pads were too thick not allowing for as much core pressure at the bottom. I spread the thermal pads, a clay like type easy to change until putting the GPU together showed that thermal paste was flat. You can tell if thermal pads on the memory are too thick if they cut into the thermal pads instead of just giving and impression. It wasn't an issue a few weeks earlier but as things shift with heat it was an issue later. I've redone many without issue. I guess I'm human. Lol I use too much thermal paste as a norm. It spreads past the core. I'm trying to get better, but in this case it was all still wet so used the excess around the edge to redo and manually spread the paste. Thin manual spread looks better after putting it together and taking it apart.

@@tradingnichols2255 Here In Brazil, a channel tested how much or how little thermal paste would affect performance and concluded that using too little thermal paste is worse than using too much. This is because using too little thermal paste can lead to higher temperatures, while using too much thermal paste may not provide any significant improvement, but it also won't cause any harm as the excess paste is expelled by the heatsink. Therefore, it is better to err on the side of using too much thermal paste than too little. So, you arent really wrong of use "too much" of it.

I'm quite similar in the use of the same method of spreading a thin layer, and I too began building computers in the early 90s but with the 486 SX-25

Incorrect. Linus proved that using too much paste makes no difference, since the excess is all squeezed out during the mounting process regardless. Using too little paste can make a difference.

@@TehButterflyEffectand using just the right amount makes all the difference

@pleasurewasmine Of course you are correct. Aside from waste, cost, mess (having to clean excess off.) What other downsides are there of laying down too much?

I laughed tooo much 💀💀💀

I think it was more of a cumshot

@@Esnnete only available in Japan though

The dot had the one of the worst results it was 4th to last. The best results was the "X" and spread methods.

being a "spreader" sounds really wrong lol

@@Lillarry72 if he would have applied more than it would have been perfect coverage. Spread works best because there is no room for error with the amount . The method of application is not important, the amount of paste is. Always better to put a bit to much than to little.

But, ideally you want as little as possible, while still covering the entire surface, because thermal paste isn't as conductive as metal.

Agreed. If the 1st one applied a little bit more paste then it would've cover all sides. Sadly, this pea size thing is so overrated.

@@IrocZIV except I've used too much and thermally it makes no difference under load. Only too little makes a big difference and that's where temps are detrimental, including to long term usage. Also another thing is that the pressure from the heat sink often pushes out excess paste which means you get the same spread left behind anyway. Making your own thin spread just causes less waste, both before and after cleaning. That's about the only actual difference there is.

@@ArtisChronicles Practically, I'm sure you are right.

Except the spread will overflow at the sides before it reaches the edges due to the circular distribution.

Exactly this. The other methods might have had a much worse application than shown.

If you mount your heatsink correctly and cross screw everything will apply flat after a power on and benchmark, re tighten if possible and everything will be flatten out

Not to mention, he can't generate the same amount of pressure pushing with his hands that a correctly mounted heatsink will do. The grain of rice method is fine, biggest thing is making sure you have the right amount. If you are new to doing it or it's been a while, apply some, mount heatsink, remove heatsink and see how much or little is covered. Remove and reapply with appropriate amount. Stressing the cpu will also heat the paste and spread it out more.

Dunno, seems like the pressure from the heatsink wasn't able to spread out the paste. 86c grain of rice vs 84c spread. Not a big deal but it's there.

@@Ammothief41 thats margin of error territory. Specailly since we don't know if his room say went to 31c instead of 30c or vice versa having a perfectly stable 30c unless he had ac controlling it to that doesn't really happen. But even then +-2c across cinnbench runs is pretty common

If you use liquid metal too much is very bad, it can corrode your board.

@@logan594 Well, the topic in the video and my post is about applying thermal compound based on silicon, not about liquid metal. So is out of topic. In other hand, I've never considered and never recommend using liquid metal because is Gallium which diffuses molecularly by contact in the crystal lattice of other metals (that is the "corrosive" effect you mentioned) and it is an electrical conductor, so is dangerous and the benefits are not so great to risk your components, is safer to invest in a better cooling solution.

Marius X4 I agree, just mentioning. I’m so lazy I don’t even take off stock compound. 3950x stays in 50’s good enough for me.

If you use too much and it seeps out you may have a hard time taking out any cpu cooler as the compound hardens!

While too much isn't inherently bad it does very much depend on the formula of the thermal compound being used, some compounds do contain materials that make them electrically conductive or capacitive in which case you want to be cautious with your application. Most modern compounds are likely safe but it's something you should make sure of, and when applying it I would personally prefer to spread it myself to ensure maximum coverage.

Believe it!

I mean that first one looks pretty circular

There's virtually no difference between any of the application methods, you just want to make sure the whole IHS is covered

yep, always makes best result, you just have to be good at spreading the right amount!

Wowitsshit What is the best one

@@herocosmogt8335 the paste? i used arctic mx-4, but i hear the thermal grizzly is even better. i spread with credit card! is best! but don't agitate the paste too much to work air bubbles in it.

Wowitsshit I will use the spread or x method

@@herocosmogt8335 yeah X sounds good too, dot in middle never spreads out over the whole thing.

I also use the spread and use a completely clean plastic bag and finger to do the spreading.

Thermal grizzly comes with an applicator that has a spreader on it. Ever since i started using TG i have used the spread method.

I'm not a fan of the spread method, as you can see when the glass is pushed down, tiny pockets of air can be trapped for lack of an escape path. The X method allows all of the air to be evacuated out of the 4 "V" shaped channels as the paste spreads and the gap closes, I prefer X method augmented with a little extra dab at the intersection point to ensure that the middle is the first place that the cooler contacts and begins spreading paste from. Spread can absolutely work, but the potential for a less than ideal thermal interface is there, also don't forget that any trapped air expands when it gets hot.

@@blackbeardthepirate7467 air is definitely not a good thermal conductor. So many thermal tests have been done on different paste application methods by many different testers and there's rarely a significant enough difference to any method that has enough paste. Unless you're going all out for a few degrees difference in delta T, there really isn't much of a way to go wrong aside from forgetting to remove the plastic from your shiny new cooler's cold plate. I honestly only prefer the spread method for these reasons: 1. About 15 years ago, a finessed spread method made a measurable difference in thermals for me 2. The overflow is nearly imperceptible, meaning less cleanup each time you remove the cooler 3. It has never failed me, and every time I put together a computer since, my thermals are among the best for similar OC/benchmark scores. While #3 could be a result of lucky bin lottery with the CPU, the first two are not. As such, I'm sticking with something I've experienced great results with. *when I say spread method, I certainly don't mean like you're buttering a piece of toast like some people seem to do. That shit don't work worth a damn.

I spread, but not quite to the edge and not flat, slightly raised in the middle. The paste has somewhere to go and no air bubbles. ..also use a spreader the same size as the chip!

Now they will ask why dont you just make a cross since its faster and easier lol