PRODUCT DESCRIPTION
MAX MCR A/B is an epoxy-based, medium working time, low viscosity potting compound resin system used to pot or encapsulate printed circuit boards (PCB), mechanical relays, induction coils, and other electronic or electrical circuitry.
MAX MCR A/B is low in viscosity and self-levels as it cures at room temperature. It is mixed 2:1 by weight or volume and provides a 30 minute working time (200-gram mass @ 75°F).
Upon cure, MAX MCR is none electrically conductive that seals and waterproofs open circuitry and provides permanent masking for custom and proprietary circuitry and electronic components.
MAX MCR A/B bonds to PVC, PP, ABS, Plastisol, aluminum, steel, copper, brass, and other materials typically used in electrical circuits.
MAX MCR A/B is mixed 2:1 by weight or by volume ratio. The mixed consistency is easily poured or injected in place. It cures to a hard but tough opaque black compound suitable for small to medium parts without excessive exothermic heat generation up to 1 pint or 500 ml of volume.
Available in several kit sizes at;
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Polymer Composites, Inc
The Epoxy Experts